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EVALUASI DESAIN RANCANG BANGUN PUNCH DAN DIE MENGGUNAKAN SIMULASI STATIK SEBAGAI QUALITY CONFIRMATION Edwin Sahrial Solih; Ahmad Arif; Sanurya Putri Purbaningrum; Desy Agustin; Abdul Wahid Arohman; Fadhil Fadhlurrohman Nurhadi; Fredy Sumasto
Scientific Journal of Mechanical Engineering Kinematika Vol 10 No 1 (2025): SJME Kinematika Juni 2025
Publisher : Mechanical Engineering Department, Faculty of Engineering, Universitas Lambung Mangkurat

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.20527/sjmekinematika.v10i1.727

Abstract

Modern manufacturing industries demand high efficiency and consistent product quality, especially in metal forming processes such as stamping dies. An accurate punch and die design essential to ensure the success of bending operations, particularly for metal-based products like forks. This study aims to evaluate the structural reliability of punch and die designs through a static simulation approach as a quality confirmation method prior to manufacturing. The methodology includes die geometry design, selection of SKD11 tool steel based on its mechanical properties, and stress analysis using SolidWorks software under a static load of 35 tons. The stress distribution was analyzed using the Von Mises method, and the Factor of Safety (FOS) was calculated as a design safety indicator. Simulation results show that the maximum stress on the die was 9.91 × 10⁷ N/m² and on the punch was 1.01 × 10⁸ N/m², both well below the yield strength of SKD11 (6.88 × 10⁸ N/m²). The FOS values of 3.47 for the die and 3.26 for the punch confirm structural safety. Validation through trial dies and 3D scanner measurements indicated dimensional deviations within the acceptable tolerance range. This approach effective for improving design accuracy and production efficiency in stamping die manufacturing.
Effect of SiO₂ Nanoparticle Dispersion on The Stability and Thermal Conductivity of Polyvinyl Ether-Based Nanolubricant Safril, Safril; Solih, Edwin Sahrial; Gurning, Ridho Hans; Shalihah, Adinda Rahmah; Arohman, Abdul Wahid
G-Tech: Jurnal Teknologi Terapan Vol 10 No 1 (2026): G-Tech, Vol. 10 No. 1 January 2026
Publisher : Universitas Islam Raden Rahmat, Malang

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.70609/g-tech.v10i1.8987

Abstract

Heat transfer efficiency in lubrication systems can be achieved by utilising nanolubricants by dispersing nanoparticle additives into pure lubricants to increase nanolubricant stability and thermal conductivity. This study aims to investigate the effect of silicon dioxide (SiO₂) nanoparticle dispersion in polyvinyl ether (PVE)-based lubricants on the stability and thermal conductivity characteristics of nanolubricants. SiO₂/PVE nanolubricant was prepared using a two-step method with a volume concentration of 0.007%. Stability evaluation was carried out through UV–Vis spectrophotometry testing over a period of 30 days. Thermal conductivity was measured using KD2-Pro at a temperature range of 30 ℃ to 80 ℃. The results of the study showed that SiO₂/PVE was declared stable after 144 hours with an absorbance of 80%. Thermal conductivity characteristics decreased with increasing temperature, and the nanolubricant increased compared to PVE lubricants. The maximum increase in thermal conductivity was 2.72% compared to the pure lubricant, and at a test temperature of 30 °C, SiO₂/PVE was compared to SiO₂/corn oil, SiO₂/paraffin oil, SiO₂/sunflower SiO₂/oil, and SiO₂/soybean oil; the results showed an increase in thermal conductivity of 66.69%, 80.63%, 67.70%, and 46.45%, respectively. The thermal conductivity behaviour tends to increase when SiO₂ nanoparticles are dispersed into the pure lubricant, compared to the pure PVE lubricant and previous studies. These findings indicate that SiO₂/PVE nanolubricant produces a significant increase in thermal conductivity, resulting in accelerated heat transfer, reduced friction and wear, and ultimately leading to increased energy efficiency and improved overall system performance.