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Journal : Metalurgi

Microstructural Stability and High-Temperature Oxidation Behavior of Al0.25CoCrCuFeNi High Entropy Alloy Muhammad, Fadhli; Lestari, Ernyta Mei; Achmad, Tria Laksana; Korda, Akhmad Ardian; Prawara, Budi; Prajitno, Djoko Hadi; Jihad, Bagus Hayatul; Setianto, Muhamad Hananuputra; Basuki, Eddy Agus
Metalurgi Vol 39, No 1 (2024): Metalurgi Vol. 39 No. 1 2024
Publisher : National Research and Innovation Agency (BRIN)

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.55981/metalurgi.2024.745

Abstract

Al0.25CoCrCuFeNi is a high-entropy alloy composed of transition metals, specifically designed for high-temperature applications owing to its favorable mechanical properties, high melting point, and excellent high-temperature resistance. This alloy has been identified as a promising material for space exploration, particularly in the fabrication of combustion chambers and rocket nozzles by the National Aeronautics and Space Agency. Ongoing alloy development involves modifying the elemental composition. This study reduced aluminum content in the equiatomic AlCoCrCuFeNi alloy to Al0.25CoCrCuFeNi, followed by isothermal oxidation treatments at 800, 900, and 1000℃. A series of experiments were conducted to investigate the microstructure stability and oxidation behavior of the Al0.25CoCrCuFeNi alloy. The alloying elements were melted using a single DC electric arc furnace, followed by homogenization at 1100°C for 10 hours in an inert atmosphere. Subsequently, samples were cut into coupons for isothermal oxidation testing at the desired temperatures for 2, 16, 40, and 168 hours. The oxidized samples were characterized using XRD (x-ray diffraction), SEM (scanning electron microscopy) equipped with EDS (energy-dispersive X-ray spectroscopy), optical microscopy, and Vickers hardness testing. The as-homogenized alloy consisted of two constituent phases: an FCC (face-centered cubic) phase in the dendritic region and a copper-rich FCC phase in the inter-dendritic region. The oxides formed during the oxidation process included Al2O3, Cr2O3, Fe3O4, CoO, CuO, NiO, and spinel oxides (Co,Ni,Cu)(Al,Cr,Fe)2O4), with distinct formation mechanisms at each temperature.
Synthesis of Mesoporous Nickel Using Electrodeposition Method Latifah, Sri Mulyati; Vito, Mochammad Ghais; Prajitno, Djoko Hadi
Metalurgi Vol 39, No 2 (2024): Metalurgi Vol. 39 No. 2 2024
Publisher : National Research and Innovation Agency (BRIN)

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.55981/metalurgi.2024.704

Abstract

Mesoporous material technology has recently become increasingly popular among scientists and industry professionals. Electrodeposition is a metal deposition process that employs an electric current. The most typical applications of electrodeposition are metal coating (electroplating) and the creation of porous materials. This study aimed to analyze the effects of current and nickel synthesis time on the formation of mesoporous nickel morphology using corn starch. The method for producing mesoporous nickel deposits uses an electrodeposition process using corn starch additives. The process of making mesoporous nickel varies at currents of 4, 5, and 6 A, holding times of 3, 4, and 5 hours, and additional weights of corn starch of 1, 2, and 3 g, with the weight of nickel deposits produced being 1.19, 1.3, and 1.9 g, with an increase in nickel deposits from currents of 4 to 6 A (holding time of 3 to 5 hours) of 0.71 g (59.66%). The smallest pore diameter of 112 nm was obtained using a current of 6 A, a holding time of 5 hours, with 3 g of corn starch. Characterization was carried out on the electrodeposition layer using XRD (x-ray diffraction) and SEM-EDS (scanning electron  icroscope-energy dispersive spectroscopy), where the results of the XRD analysis showed the presence of α-Ni, Ƴ-Fe, and Fe1Ni3 compounds, and the results of SEM-EDS showed porous Ni deposits with the highest Ni concentration above 80%. The bigger the current employed and the holding period in the electrodeposition process, the heavier the Ni deposit formed.