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All Journal JURNAL INTEGRASI JURNAL PENDIDIKAN TAMBUSAI Jurnal Teknologi dan Riset Terapan (JATRA) Journal of Applied Electrical Engineering Jurnal Pengabdian kepada Masyarakat Politeknik Negeri Batam Innovative: Journal Of Social Science Research Journal of Sustainable Community Development
Muhammad Naufal Airlangga Diputra
Politeknik Negeri Batam
Aerospace Engineering Humanities Computer Science & IT Control & Systems Engineering Economics, Econometrics & Finance Electrical & Electronics Engineering Engineering Environmental Science Law, Crime, Criminology & Criminal Justice Mechanical Engineering Public Health Social Sciences Other

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Journal : Journal of Applied Electrical Engineering

 1 
Evaluasi Kualitas pada PCB Hasil Proses Immersion Tin Vivin Octowinandi; Fadli Firdaus; Ridwan Ridwan; Diono Diono; Rifqi Amalya F; Muhammad Naufal Airlangga Diputra; M Rif'an Maulana
Journal of Applied Electrical Engineering Vol. 7 No. 1 (2023): JAEE, June 2023
Publisher : Politeknik Negeri Batam

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.30871/jaee.v7i1.5492

Abstract

The PCB manufacturing process involves many processes, one of which is Surface finishes. One type of Surface finishes commonly used is Immersion tin. Immersion tin is a Surface finishes process that uses pure tin in the process. Immersion tin protects the copper from oxidation and makes the copper surface or pad easy to solder. The cleanliness of the pad and the thickness of the Immersion tin affect the quality of the PCB produced. Therefore, the researchers evaluated the quality of the results of the Immersion tin process using the DOE (Design of Experiment) method. Where this method can help in determining the optimal parameters. The variables used are Storage Time After Microetch and Immersion in tin Bath. In the research process it was found that PCBs underwent morphological changes at 23 hours after being stored in storage. This is caused by the presence of moisture that is still present on the PCB as a result of not being optimal during the drying process. In this study, the optimal Solder Coating Thickness in the 14th sample was 4.59 µm and with the parameters Storage Time After Microetch for 50 minutes and Immersion in tin Bath for 120 minutes. For the most optimal pad cleanliness found in the 5th and 12th samples with the Storage Time After Microetch parameter for 30 minutes and 60 minutes and marked by the absence of contaminants on the pad. In addition, in this study there were less than optimal mapping results marked by only 1 part of 1 sample containing tin from 16 test samples. The sample is the 3rd sample with the parameter Storage Time After Microetch for 10 minutes and Immersion in tin Bath for 55 minutes with a tin content of 91.9%.
Pengukuran Kemampuan Manufaktur PCB Empat Layer di TFME Octowinandi, Vivin; Risandriya, Sumantri K.; Asaad, Nur Sakinah; Diputra, Muhammad Naufal Airlangga; Ria, Riki; Pratama, Adjie Sukma; Wivanius, Nadhrah
Journal of Applied Electrical Engineering Vol. 8 No. 1 (2024): JAEE, June 2024
Publisher : Politeknik Negeri Batam

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.30871/jaee.v8i1.6991

Abstract

Saat ini PCB multi-layer banyak digunakan pada rangkaian elektronik karena mampu menyediakan PCB dengan kepadatan komponen yang lebih tinggi, kecepatan tinggi dan ukuran PCB yang relatif lebih kecil dibandingkan dengan PCB single layer. Untuk menjawab kebutuhan pasar, TFME (Teaching Factory Manucacturing of Electronics) yang merupakan salah satu laboratorium di lembaga Politeknik Batam, dirasa perlu melakukan penelitian untuk mengukur kemampuan produksi di bidang manufaktur PCB multi-layer, khususnya empat layer. Total PCB empat layer yang dibuat adalah sejumlah sembilan belas unit. Adapun metoda yang digunakan untuk mengukur kemampuan TFME dalam membuat PCB empat layer adalah dengan cara mengukur kesesuaian koneksi jalur tembaga terhadap desain dan pengecekan visual kesejajaran antar layer menggunakan mesin x-ray. Dari hasil pengujian dapat diketahui bahwa untuk PCB yang menggunakan via ukuran 0.7mm tidak memiliki cacat jalur putus.
Co-Authors Abda Abda Abrajano, Muhamad Shafiq Adlian Jefiza Akbar, Muahmmad Daneoviori Al Gufran, Hasbi Faturrahman ANUGERAH WIBISANA Arif Wahyu Budiarto Aryeni, Illa Asaad, Nur Sakinah Budiana, Budiana Darmoyono, Aditya Gautama Diono Diono Eka Mutia Lubis Fadli Firdaus Fitriyanti Nakul Gusnam, Mu’thiana Handri Toar Hasnira Hasnira, Hasnira Illa Aryeni Jefiza, Adlian Kamarudin Kamarudin Kita, Lalu Kaisar Wisnu M Rif'an Maulana Mahdaliza, Rahmi Manurung, Anjunius Maulidiah, Hana Mutialif Mishthafiyatillah, Mishthafiyatillah Muhammad Imron Shodiq Mulyono, Dwi Imam Nadhrah Wivanius, Nadhrah Naurah Nazhifah Nugraha, Danu Satia Nugraha, Muhammad Wahyu Nur Sakinah Asaad Nurhasanah, Armeilia Octowinandi, Vivin Oktani, Dessy Pitriani, Shelly Sri Pratama, Adjie Sukma Putra, Irwanto Zarma Rafif, Carelenton Muhammad Ramadhan, Farhan Rizqi RIA ANGGRAINI Ria, Riki Ridwan Ridwan Rifqi Amalya F Risandriya, Sumantri K. Risandriya, Sumantri Kurniawan Rizky Saputra, Rizky Siregar, Nahum Hita Dior Sugandi, Budi Sulaiman, Habib Suprayogi, Bagus Syafi’i, Ahmad Syahputra, Rezza Eka Vivin Octowinandi Wicaksono, Muhammad Jaka Wimbang Widya Rika Puspita Wifandi, Akhfi