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All Journal IPTEK The Journal of Engineering Jurnal Online Mahasiswa (JOM) Bidang Keguruan dan Ilmu Pendidikan Biotropika EDUCATIO : Journal of Education Transformatif Jurnal Kefarmasian AKFARINDO Scientific Journal of Informatics Juminten : Jurnal Manajemen Industri dan Teknologi Jurnal Riset dan Pengabdian Masyarakat Jurnal Kedokteran Komunitas (Journal of Community Medicine) Pharmaqueous Jurnal Ilmu Pendidikan Jurnal Sadewa: Publikasi Ilmu Pendidikan, Pembelajaran dan Ilmu Sosial Al-Zayn: Jurnal Ilmu Sosial & Hukum Cendikia Pendidikan Jurnal Media Akademik (JMA) EduInovasi: Journal of Basic Educational Studies PENG: Jurnal Ekonomi dan Manajemen AL-Ikhtiar : Jurnal Studi Islam
Nurul Faizah
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Effect of Current Density, Surfactants, and CuSO4 Concentration on Copper Electroplating of Iron Surfaces Anisa Fatma Aulia; Nurul Faizah; Gladys Sukma Thufailah
IPTEK The Journal of Engineering Vol. 12 No. 1 (2026)
Publisher : Institut Teknologi Sepuluh Nopember

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.12962/j28075064.v12i1.9683

Abstract

Corrosion poses a serious threat to various industries, leading to financial burdens and infrastructure deterioration. This research investigates the influence of current density, surfactants, and CuSO₄ concentration on the electroplating process of copper onto iron surfaces. Current densities of 0.069825, 0.078069, 0.082062, 0.096939, and 0.129863 A in⁻², boric acid surfactant concentrations of 0.6, 0.9, 1.2, 1.5, and 1.8 g, and CuSO₄ concentrations of 0.40, 0.45, 0.50, 0.55, and 0.60 N were analyzed to assess their effects on the quality of the deposited copper layer. For each condition the deposited layer was evaluated through changes in specimen thickness and mass and through an extrapolated corrosion rate (mils per year, mpy) of the copper anode. Increasing current generally raised the amount of deposited copper, but the relationship with thickness, mass, and corrosion rate was non-monotonic rather than strictly increasing, indicating that current alone does not control coating quality. Adding boric acid buffer promoted a smoother deposit and, at the highest addition (1.8 g), coincided with the lowest measured anodic corrosion rate; excessive amounts, however, are undesirable on adhesion and toxicity grounds. Within the range tested, a moderate CuSO₄ concentration gave the most uniform deposition. Because corrosion rates were extrapolated to an annual basis from very short (5 min) tests, the absolute mpy values should be read as relative comparisons only. The results underline the need to tune, rather than simply maximise, electroplating parameters to obtain a high-quality copper coating on iron.
Co-Authors Ahmad Ansori Amrina Amalia Yogananda Anisa Fatma Aulia Anisatun Awaliyah Aprilianti, Putri Ariya Saputra Cut Kumala Sari Didik Tri Setiyoko Diena Noviarini Dinda Nila Sabrina Elok Mulazamah Erlina Purnamawati Erna Sulistyowati Eti Setiawati Fadhilah Nur Andari Gladys Sukma Thufailah Hilda Fairuzia Khaidaroh Hilda Kartini ' Lutfiana Sefira Martinis Yamin Moch Sasmito Djati Muhammad Wildan Romdhoni Mumpuni, Atikah Neng Suryanti, Neng Suryanti Nisaul Fadillah Nur Qalbi Putri Fajariah Resky Saputra Reza Hakim Rinanda Ramadhani Riska Amaliah Saiful Salniyah Sofyan Sukrian Sachputra Sony Difa Febrianda Sri Aju Indrowaty Sri Hardiyanti Tranggono Umi Widyastuti Wildan Hidayat Wiranto Aji Dewandono Yenita Roza Zahra Rifandani Amatullah