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Journal : Journal of Applied Electrical Engineering

Reducing Coating Defects by Implementing Auto Dripping System on The Finishing Machine Octowinandi, Vivin; Firdaus, Fadli; Arifin, Muhammad; Maulidiah, Hana Mutialif; Iqbal, Muhammad
Journal of Applied Electrical Engineering Vol 7 No 2 (2023): JAEE, December 2023
Publisher : Politeknik Negeri Batam

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.30871/jaee.v7i2.6722

Abstract

Finishing Process is one of the most important processes in the manufacture of resistors, because it is the process of forming the resistor body by coating the resistor with a coating liquid. However, in this process there are still many cases of product defects, one of the main causes is the uncontrolled viscosity of the coating liquid causing the formation of body resistors is not good, or what is called Body deform and body thin defects. Auto Dripping is a useful tool for automatically dripping methanol liquid which aims to control the viscosity of the coating liquid in the finishing process. Because Auto Dripping is a tool that has just been implemented and does not yet have the right parameter settings, it is necessary to do trials to find the right parameters so that Auto Dripping functions properly. In Auto Dripping there are two settings that can be controlled, namely Stroke Speed and Stroke Length, these two settings affect the output of methanol liquid that comes out. In this study using SPC tools to analyze the parameters being tested, namely the Control Chart which is used to monitor the stability of a process and study process changes from time to time. then, in this study also used the Process Capability Analysis method. This method is very effective in viewing the performance of a process, is used to measure process capability by comparing its distribution with the distribution of specifications accurately and provides a clearer picture. After carrying out this project, the authors concluded that the implementation of the Auto Dripping set up parameter has proven to be quite influential in reducing the case of coating defects caused by uncontrolled viscosity, namely by maintaining the stability of the coating viscosity so that it can produce resistors that meet specifications. From the data above, the production of resistors has been running stably with a period of 5 weeks, with 100 resistor samples being measured. With an average value of 2.82 mm. As for the Cpk value after implementing the new parameter setup, which is 3.35, this is a high result and meets the standard, which is ≥1.5.
Evaluasi Kualitas pada PCB Hasil Proses Immersion Tin Vivin Octowinandi; Fadli Firdaus; Ridwan Ridwan; Diono Diono; Rifqi Amalya F; Muhammad Naufal Airlangga Diputra; M Rif'an Maulana
Journal of Applied Electrical Engineering Vol. 7 No. 1 (2023): JAEE, June 2023
Publisher : Politeknik Negeri Batam

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.30871/jaee.v7i1.5492

Abstract

The PCB manufacturing process involves many processes, one of which is Surface finishes. One type of Surface finishes commonly used is Immersion tin. Immersion tin is a Surface finishes process that uses pure tin in the process. Immersion tin protects the copper from oxidation and makes the copper surface or pad easy to solder. The cleanliness of the pad and the thickness of the Immersion tin affect the quality of the PCB produced. Therefore, the researchers evaluated the quality of the results of the Immersion tin process using the DOE (Design of Experiment) method. Where this method can help in determining the optimal parameters. The variables used are Storage Time After Microetch and Immersion in tin Bath. In the research process it was found that PCBs underwent morphological changes at 23 hours after being stored in storage. This is caused by the presence of moisture that is still present on the PCB as a result of not being optimal during the drying process. In this study, the optimal Solder Coating Thickness in the 14th sample was 4.59 µm and with the parameters Storage Time After Microetch for 50 minutes and Immersion in tin Bath for 120 minutes. For the most optimal pad cleanliness found in the 5th and 12th samples with the Storage Time After Microetch parameter for 30 minutes and 60 minutes and marked by the absence of contaminants on the pad. In addition, in this study there were less than optimal mapping results marked by only 1 part of 1 sample containing tin from 16 test samples. The sample is the 3rd sample with the parameter Storage Time After Microetch for 10 minutes and Immersion in tin Bath for 55 minutes with a tin content of 91.9%.