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Journal : Infotekmesin

Potensi Serat Pelepah Nipah Sebagai Bahan Baku Binderless Fiberboard Kristiningsih, Ari; Wittriansyah, Khoeruddin; Ariawan, Radhi
Infotekmesin Vol 16 No 1 (2025): Infotekmesin: Januari 2025
Publisher : P3M Politeknik Negeri Cilacap

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.35970/infotekmesin.v16i1.2507

Abstract

Fiberboard uses a lot of agro-industry waste materials combined with synthetic adhesives containing formaldehyde. The weakness of this adhesive is that it can cause health problems such as cancer and eye irritation. Lignin has properties and content similar to formaldehyde. Nipah has lignin and cellulose content that can be developed into binderless fiberboard. The purpose of this study was to analyze the potential of Nipah frond fiber to make a binderless fiberboard. The characteristics of fiberboard that will be explored include density and water content. Nipah frond binderless fiberboard is made using a press machine with a pressure of 50 bar, and a temperature of 100oC for 20 minutes. The density between 0.46-0.52 which is by the requirements of SNI 03-2105-2006 and the water content of 5.98% - 7.70% is also by the requirements of JIS 5908: 2003 and SNI 03-2105-2006. Based on these results, it can be concluded that Nipah fronds can be used as raw material for binderless fiberboard.
Karakteristik Struktur Kristal In2Se3 Hasil Preparasi Dengan Metode Bridgman Ulikaryani, Ulikaryani; Sodikin, Jenal; Akhlis Sarihidaya Laksana, Nur; Satria Jati, Unggul; Kristiningsih, Ari
Infotekmesin Vol 14 No 1 (2023): Infotekmesin: Januari, 2023
Publisher : P3M Politeknik Negeri Cilacap

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.35970/infotekmesin.v14i1.1753

Abstract

Apart from using silicon material, thin-layer solar cells can be made from various types of semiconductor materials, such as a combination of groups III and VI. In solar cell applications, these materials are usually used as n-type coatings. This study not only aimed to determine the crystal structure and the effect of annealing temperature on the crystal lattice parameters but also to determine the chemical composition and surface morphological structure of the crystals formed from the preparation. The crystal growth process was carried out using the Bridgman method with different heating patterns. The temperature in both annealing temperatures is 200oC and 250oC. The physical properties of the prepared In2Se3 crystals were characterized using XRD, SEM, and EDAX. XRD Characterization was used to determine the crystal structure, while SEM and EDAX characterization was used to determine the surface morphology and chemical composition of the crystals. The result of the XRD characterization showed that the formed In2Se3 crystals were polycrystals with a hexagonal structure. Based on the diffractogram obtained, the In2Se3 crystalline heating 1 has better quality. EDAX analysis showed that the In2Se3 crystals were composed of elements of In and Se with a mole ratio of 2:9, while the SEM characterization showed that the color of the surface morphology of the In2Se3 crystals was not homogeneous.
Potensi Serat Pelepah Nipah Sebagai Bahan Baku Binderless Fiberboard Kristiningsih, Ari; Wittriansyah, Khoeruddin; Ariawan, Radhi
Infotekmesin Vol 16 No 1 (2025): Infotekmesin: Januari 2025
Publisher : P3M Politeknik Negeri Cilacap

Show Abstract | Download Original | Original Source | Check in Google Scholar | DOI: 10.35970/infotekmesin.v16i1.2507

Abstract

Fiberboard uses a lot of agro-industry waste materials combined with synthetic adhesives containing formaldehyde. The weakness of this adhesive is that it can cause health problems such as cancer and eye irritation. Lignin has properties and content similar to formaldehyde. Nipah has lignin and cellulose content that can be developed into binderless fiberboard. The purpose of this study was to analyze the potential of Nipah frond fiber to make a binderless fiberboard. The characteristics of fiberboard that will be explored include density and water content. Nipah frond binderless fiberboard is made using a press machine with a pressure of 50 bar, and a temperature of 100oC for 20 minutes. The density between 0.46-0.52 which is by the requirements of SNI 03-2105-2006 and the water content of 5.98% - 7.70% is also by the requirements of JIS 5908: 2003 and SNI 03-2105-2006. Based on these results, it can be concluded that Nipah fronds can be used as raw material for binderless fiberboard.